The Dielectric Properties and Thermal Conductivities of Epoxy Composites Reinforced by Titanium Dioxide

Dielectric and thermal properties of epoxy/boron nitride nanotube composites*

We report the fabrication of and investigations into the dielectric and thermal properties of epoxy/boron nitride nanotube (BNNT) composites. It was found that BNNT fillers can effectively adjust the dielectric constant of epoxy. Moreover, the thermal conductivity of epoxy was improved by up to 69 % with 5 wt % BNNTs. Our studies indicate that BNNTs are promising nanofillers for polymers, to ob...

Thermal Property of Multi-Walled-Carbon-Nanotube Reinforced Epoxy Composites

In this study, epoxy composite specimens reinforced with multi-walled carbon nanotube filler were fabricated using shear mixer and ultra-sonication processor. The mechanical and thermal properties of the fabricated specimens were measured and evaluated. From the electron microscope images and the results from the measurements of tensile strengths, the specimens having 0.6 wt% nanotube content s...

Thermal Degradation of HDPE Short Fibers Reinforced Epoxy Composites

Thermogravimetric analysis was carried out to investigate the thermal degradation of High Density Poly Ethylene (HDPE) short fibers reinforced epoxy composites. Three composites with 5, 10 and 15 % by weight of HDPE short fiber composition were prepared using epoxy as matrix material. The HDPE short fiber used as reinforcing material into the resin helps in retarding the thermal degradation of ...

Thermal Stability and Dynamic Mechanical Properties of Nano and Micron-TiO2 Particles Reinforced Epoxy Composites: Effect of Mixing Method

Octasilsesquioxane reinforced DGEBA and TGDDM epoxy nanocomposites: Characterization of Thermal, Dielectric and Morphological properties

The octa-functionalized polyhedral oligomeric silsesquioxane (POSS) containing nanocomposites of epoxy resin are prepared via in situ co-polymerization of epoxy resins with 4,4’-diaminodiphenylsulfone (DDS) in the presence of octaaminophenyl silsesquioxane (OAPS). Two of the most common, technologically relevant epoxy resins, diglycidyl ether of bisphenol-A (DGEBA) and tetraglycidyl diamino dip...